Method and apparatus for multi-chip packaging
AssigneeSpansion LLC
InventorsYong DU, John YAN
Life of this patent
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Abstract
A method and apparatus are provided for multi-chip packaging. A multi-chip package (100) includes a substrate (105) and a plurality of semiconductor dice (110, 120, 130). A first semiconductor die (110) is physically coupled to an upper face of the substrate (105), the first semiconductor die (110) being a smallest one of the plurality of semiconductor dice (110, 120, 130).
Claims11
-10. (canceled)
An electronic device comprising:
- a controller;
- and
- a multi-chip package coupled to the controller, the multi-chip package comprising:
- a substrate;
- and
- a plurality of semiconductor dice, wherein a first one of the plurality of semiconductor dice is physically coupled to an upper face of the substrate, the first one of the plurality of semiconductor dice being a smallest one of the plurality of semiconductor dice.
A multi-chip package comprising:
- a substrate;
- and
- a plurality of semiconductor dice, wherein a first one of the plurality of semiconductor dice is physically coupled to an upper face of the substrate, the first one of the plurality of semiconductor dice being a smallest one of the plurality of semiconductor dice.
The multi-chip package in accordance with claim 16 wherein the plurality of semiconductor dice is three or more semiconductor dice, and wherein the first and second ones of the plurality of semiconductor dice are smaller than all other ones of the plurality of semiconductor dice, the second one of the plurality of semiconductor dice being larger than the first one of the plurality of semiconductor dice.
Dependencies are inferred from the claim text.