Semiconductor device and method of manufacturing the same
AssigneesSanyo Electric Co., Ltd., SANYO Semiconductior Co., Ltd.
InventorsSatoshi ONAI, Minoru Akaishi, Hiroshi Ishizeki, Yoshiaki Sano
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Abstract
An object is to prevent a failure, such as a wiring separation or a crack, in an insulating film under a copper wire, in a semiconductor device formed by wire-bonding the copper wire on a portion above the copper wiring. A semiconductor device according to the present invention includes a copper wiring formed above a semiconductor substrate, a plated layer formed so as to cover a top surface and side surfaces of the copper wiring, and a copper wire which is wire-bonded on the plated layer above the copper wiring.
Claims7
A semiconductor device comprising:
- a copper wiring formed above a semiconductor substrate;
- a plated layer formed so as to cover a top surface and side surfaces of the copper wiring;
- and
- a copper wire wire-bonded onto the plated layer above the copper wiring.
A method of manufacturing a semiconductor device comprising the steps of:
- by using a resist film formed on a semiconductor substrate as a mask, forming a copper wiring by plating on a region where the resist film is not formed;
- after removing the resist film, forming a plated layer so as to cover a top surface and side surfaces of the copper wiring;
- and
- wire-bonding a copper wire on the plated layer above the copper wiring.
A method of manufacturing a semiconductor device comprising the steps of forming a resist film on a barrier metal film formed on a semiconductor substrate;
- by using the resist film as a mask, forming a copper wiring by plating on a region where the resist film is not formed;
- after removing the resist film, removing the barrier metal film formed in a region where the copper wiring is not formed, by using the copper wiring as a mask;
- forming a plated layer so as to cover a top surface and side surfaces of the copper wiring;
- and
- wire-bonding a copper wire on the plated layer above the copper wiring.
Dependencies are inferred from the claim text.