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US 2010/0164101 A1Published application
Ball land structure having barrier pattern
AssigneeSamsung Electronics Co., Ltd.
InventorsWang-Jae Lee, Yong-Jin Jung, Jung-Hyeon Kim
Life of this patent
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Abstract
Disclosed is a ball land structure suitable for use with a semiconductor package. The ball land structure includes a ball land and a barrier on a core. The barrier may be configured to connect to the ball land so as to form a barrier hole between an edge of the ball land and an edge of the barrier thus exposing a portion of the core. A solder mask may be deposited on the ball land and a portion of the core exposed by the barrier hole so as to partially expose the core.
Claims15
A ball land structure, comprising:
- a ball land on a core;
- a barrier on the core, the barrier being configured to connect to the ball land so as to form a barrier hole between an edge of the ball land and an edge of the barrier to expose a portion of the core;
- and
- a solder mask on the ball land and the portion of the core exposed by the barrier hole to partially expose the core.
1 more element
Dependencies are inferred from the claim text.