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US 2010/0164093 A1Published application
Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside
AssigneeGlobalfoundries Inc.
InventorsAnthony Mowry, David Farber, Fred Hause, Markus Lenski
Life of this patent
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Abstract
By providing heat dissipation elements or heat pipes in temperature critical areas of a semiconductor device, enhanced performance, reliability and packing density may be achieved. The heat dissipation elements may be formed on the basis of standard manufacturing techniques and may be positioned in close proximity to individual transistor elements and/or may be used for shielding particular circuit portions.
Claims26
A semiconductor device, comprising:
- a substrate comprising a front side and a back side;
- one or more transistor elements formed in and above a semiconductor layer that is positioned above said front side;
- a metallization system formed above said semiconductor layer;
- and
- a heat dissipation element formed adjacent to said one or more transistor elements and extending into said substrate, said heat dissipation element being electrically isolated from said one or more transistor elements and said metallization system and comprising a fill material having thermal conductivity that is higher than a thermal conductivity of said semiconductor layer.
2 more elements
A substrate for forming semiconductor devices, said substrate comprising:
- a semiconductor layer positioned above a substrate material;
- and
- a heat spreading layer in contact with said substrate material, said heat spreading layer having a thermal conductivity that is greater than a thermal conductivity of said substrate material and said semiconductor material.
A method, comprising:
- forming an opening adjacent to an active semiconductor region of a semiconductor device, said opening extending at least into a substrate material of said semiconductor device;
- filling said opening with a fill material to form a heat dissipation element, said fill material having a thermal conductivity that is higher than a thermal conductivity of said substrate material;
- and
- connecting said heat dissipation element with a heat spreading layer formed above a back side of said substrate material.
1 more element
Dependencies are inferred from the claim text.