System-in-package packaging for minimizing bond wire contamination and yield loss

A method for fabricating a system-in-package module, the method comprising:

• providing a substrate having a first surface and a second surface opposite the first surface;
• forming a set of bond wire studs on bond pads on the second surface of the substrate;
• providing a first semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the first semiconductor chip is mounted to the second surface of the substrate by means of solder bumps;
• dispensing an underfill material between the first semiconductor chip and the substrate, encapsulating the solder bumps;
• providing a second semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the second semiconductor chip is mounted to the second surface of the first semiconductor chip;
• and
• wire-bonding a set of bond wires from the second semiconductor chip to the set of bond wire studs on the substrate.

A method for fabricating a system-in-package module, the method comprising:

• providing a substrate having a first surface and a second surface opposite the first surface;
• forming a first and second set of bond wire studs on bond pads on the second surface of the substrate;
• providing a first semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the first semiconductor chip is mounted to the second surface of the substrate by means of an adhesive;
• providing a second semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the second semiconductor chip is mounted to the second surface of the first semiconductor chip;
• wire-bonding a first set of bond wires from the first semiconductor chip to the first set of bond wire studs on the substrate;
• and
• wire-bonding a second set of bond wires from the second semiconductor chip to the second set of bond wire studs on the substrate.