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US 2010/0164087 A1Published application
Semiconductor device having a stacked chip structure
AssigneeRohm Co., Ltd.
InventorKazutaka Shibata
Life of this patent
Estimating the term…
Abstract
A semiconductor device is formed by mutually connecting a first semiconductor chip with second and third semiconductor chips arranged side by side, with the active surface of the first chip faced to those of the second and third chip. Both the second and third semiconductor chips have functional elements on their active surfaces. The first semiconductor chip has, in its active surface, a wiring for connecting the second semiconductor chip and the third semiconductor chip, and a terminal for external connection on its surface opposite to its active surface.
Claims20
A device comprising:
- a substrate having a substrate active surface;
- a first chip connected to the substrate;
- a first wiring formed in the substrate and arranged to connect the substrate to the first chip;
- a second wiring formed in the first chip;
- a substrate through-hole penetrating through the substrate in a thickness direction of the substrate;
- a first through-hole penetrating through the first chip in a thickness direction of the first chip;
- and
- a first bump bonding the substrate through-hole and the first through-hole, wherein
- the first wiring is greater in sectional area than the second wiring.
6 more elements
A device comprising:
- a substrate having a substrate active surface;
- a first chip connected to the substrate;
- a first wiring formed in the substrate and arranged to connect the substrate to the first chip;
- a second wiring formed in the first chip;
- a substrate through-hole penetrating through the substrate in a thickness direction of the substrate;
- a first through-hole penetrating through the first chip in a thickness direction of the first chip;
- and
- a first bump bonding the substrate through-hole and the first through-hole, wherein the first wiring is greater in width and thickness than the second wiring, or same in thickness and greater in width as compared to the second wiring, or same in width and greater in thickness as compared to the second wiring.
5 more elements
Dependencies are inferred from the claim text.