Multi-die building block for stacked-die package
AssigneeMicron Technology, Inc.
InventorsRavikumar Adimula, Myung Jin Yim
Life of this patent
Estimating the term…
Abstract
A multi-die building block for a stacked-die package is described. The multi-die building block includes a flex tape having a first surface and a second surface, each surface including a plurality of electrical traces. A first die is coupled, through a first plurality of interconnects, to the plurality of electrical traces of the first surface of the flex tape. A second die is coupled, through a second plurality of interconnects, to the plurality of electrical traces of the second surface of the flex tape.
Claims15
A multi-die building block for a stacked-die package, comprising:
- a flex tape having a first surface and a second surface, each surface comprising a plurality of electrical traces;
- a first die coupled, through a first plurality of interconnects, to the plurality of electrical traces of the first surface of the flex tape;
- and
- a second die coupled, through a second plurality of interconnects, to the plurality of electrical traces of the second surface of the flex tape.
A semiconductor package, comprising:
- a substrate;
- a stacked plurality of multi-die building blocks coupled to a surface of the substrate, each multi-die building block comprising:
- a flex tape having a first surface and a second surface, each surface comprising a plurality of electrical traces;
- a first die coupled, through a first plurality of interconnects, to the plurality of electrical traces of the first surface of the flex tape;
- and
- a second die coupled, through a second plurality of interconnects, to the plurality of electrical traces of the second surface of the flex tape;
- and
- a molding disposed above the substrate and encapsulating the stacked plurality of multi-die building blocks.
15-23. (canceled)
Dependencies are inferred from the claim text.