Back to results
US 2010/0164084 A1Published application
Semiconductor device and semiconductor package including the same
AssigneeHynix Semiconductor Inc.
InventorsJun-Ho LEE, Hyung-Dong Lee, Hyun-Seok Kim
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor device capable of removing a power ground grid noise using a small area. The semiconductor device includes a first chip including at least one decoupling capacitor; and a second semiconductor chip stacked over the first semiconductor chip, including internal circuits.
Claims14
A semiconductor device, comprising:
- a first chip including at least one decoupling capacitor;
- and
- a second chip stacked over the first chip, including internal circuits.
A semiconductor package, comprising:
- a wire board;
- a first chip stacked over the wire board, including at least one decoupling capacitor;
- and
- a second chip stacked over the first chip, including internal circuits.
1 more element
Dependencies are inferred from the claim text.