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US 2010/0164083 A1Published application
Protective thin film coating in chip packaging
AssigneeNumonyx B.V.
InventorMyung Jin Yim
Life of this patent
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Abstract
A protective thin film coating for device packaging. A dielectric thin film coating is formed over die and package substrate surfaces prior to applying a molding compound. The protective thin film coating may reduce moisture penetration from the bulk molding compound or the interface between the molding compound and the die or substrate surfaces.
Claims12
A method of packaging a microelectronic die, comprising:
- attaching a first side of the die to a first side of a package substrate;
- forming a substantially conformal dielectric thin film over a second side of the die and over the first side of the package substrate;
- and
- applying a molding compound over the substantially conformal dielectric thin film coating.
1 more element
A method of packaging a memory chip, comprising:
- attaching, with a first die attach material, a first memory chip to a first side of a package substrate;
- bonding a first wire from a first bond pad on the first memory chip to a second bond pad on the first side of the package substrate;
- attaching, with a second die attach material, a second memory chip to the first memory chip;
- bonding a second wire from a third bond pad on the second memory chip to a fourth bond pad on the first side of the package substrate;
- forming a substantially conformal dielectric thin film coating over both the first and second memory chip stack, adjacent to the first and second die attach materials, over the second and fourth bond pad, and encasing the first and second bonded wires;
- applying a molding compound over the substantially conformal dielectric thin film coating to surround the substantially conformal dielectric thin film encasing the first and second bonding wires.
3 more elements
12-20. (canceled)
Dependencies are inferred from the claim text.