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AssigneeKoninklijke Philips Electronics N.V.
InventorsRonald Dekker, Marc Andre De Samber, Wilhelmus Hendrikus De Haas, Theodorus Martinus Michielsen, Franciscus Adrianus Cornelis Maria Schoofs, Nicolaas Johannes Anthonius Van Veen
Estimating the term…
The assembly (100) comprises a laterally limited semiconductor substrate region (15) in which an electrical element (20) is defined. Thereon, an interconnect structure (21) is present. This is provided, at its first side (101) with contact pads (25,26) for coupling to an electric device (30), and at its second side (102) with connections (20) to the electrical element (11). Terminals (52,53) are present at the second side (102) of the interconnect structure (21), and coupled to the interconnect structure (21) through extensions (22,23) that are laterally displaced and isolated from the semiconductor substrate region (15). An electric device (30) is assembled to the first side (101) of the interconnect structure (21), and an encapsulation (40) extending on the first side (101) of the interconnect structure (21) so as to support it and encapsulating the electric device (30) is present.
A method of manufacturing a semiconductor assembly, comprising the steps of:
A semiconductor assembly comprising:
A carrier substrate comprising a semiconductor substrate with a first side and an opposite second side, and with at least one electrical element defined in a region in the substrate at the first side, further comprising an interconnect structure that is present on the first side of the substrate, in which interconnect structure are defined:
Dependencies are inferred from the claim text.