Package assembly for semiconductor devices

An electronic device containing a semiconductor package, the semiconductor device comprising:

• a heat sink exposed on a first surface of the package;
• a leadframe with an exposed drain pad located on a second surface of the package opposite the first surface, the leadframe also containing an exposed gate lead, exposed drain leads, and exposed source leads;
• a semiconductor die containing an IC device located between the heat sink and the leadframe, wherein a gate of the IC device is connected to the gate lead using a bond wire or a gate interconnect clip;
• and
• a molding material encapsulating the heat sink, the leadframe, and the die except for their exposed portions.

A method of making a semiconductor package, comprising:

• providing a heat sink exposed on a first surface of the package;
• providing a leadframe with an exposed drain pad located on a second surface of the package opposite the first surface, the leadframe also containing an exposed gate lead, exposed drain leads, and exposed source leads;
• providing a semiconductor die containing an IC device located between the heat sink and the leadframe, wherein a gate of the IC device is connected to the gate lead using a bond wire or a gate interconnect clip;
• and
• providing a molding material to encapsulate the heat sink, the leadframe, and the die except for their exposed portions.

A method for making a semiconductor package, comprising:

• providing a leadframe, the leadframe containing a die attach pad and a gate lead;
• providing a semiconductor die with an IC die containing a gate;
• attaching the die to the die attach pad of the leadframe;
• electrically connecting the gate of the IC device to the gate lead of the leadframe;
• attaching a heat sink to an upper surface of the MOSFET device using a source pad;
• and
• encapsulating the resulting structure except for an upper surface of the heat sink, a lower surface of the drain pad, and an end portion of the gate lead.