Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
AssigneePanasonic Corporation
InventorsKoichi Hirano, Tetsuyoshi Ogura, Seiichi Nakatani
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Abstract
A semiconductor chip comprising a capacitor capable of effectively controlling the voltage drop of an LSI is provided. A semiconductor substrate is provided with an element electrode having at least its surface constituted of an aluminum electrode. The surface of the aluminum electrode is roughened. An oxide film is provided on the aluminum electrode. A conductive film is provided on the oxide film. The aluminum electrode, oxide film and conductive film form a capacitor.
Claims14
A semiconductor chip having a semiconductor substrate provided with a plurality of element electrodes having at least their surfaces constituted of an aluminum electrode thereof, wherein
- surfaces of the aluminum electrodes are roughened,
- an oxide film is provided on the aluminum electrodes,
- an electrically conductive film is provided on the oxide film, and
- the aluminum electrodes, the oxide film and the conductive film form a capacitor.
A process for producing a semiconductor chip comprising steps of:
- preparing a semiconductor chip comprising a plurality of element electrodes;
- forming underlaying electrodes on a surface of the semiconductor chip on which the plurality of element electrodes are formed so as to cover the plurality of element electrodes;
- forming aluminum electrodes selectively on surface sections of the underlaying electrodes respectively positioned above the element electrodes;
- roughening surfaces of the aluminum electrodes and forming an oxide film on the aluminum electrodes by anodizing the aluminum electrodes in a state where a voltage is applied to the underlaying electrodes;
- and
- forming a conductive film on the oxide film.
Dependencies are inferred from the claim text.