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US 2010/0164058 A1Published application
Chip package with stacked inductors
OwnerJeff BIAR, Jacky Leeinventors
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Abstract
A semiconductor chip package with inductors includes a substrate, a semiconductor chip, an inductor and an insulator cover. The substrate has an active surface with a patterned circuit thereon. The inductor disposes on the active surface of the substrate. The semiconductor chip stacks over the inductor and electrically interconnects with the patterned circuit of the substrate and the inductor. The insulator cover encapsulates the inductor and the chip.
Claims9
A chip package, comprising:
- a substrate having an active surface with a patterned circuit thereon;
- an inductor attached on said active surface of said substrate;
- a semiconductor chip stacked over said inductor and electrically interconnected with said patterned circuit and said inductor;
- and
- an insulator cover encapsulating said inductor and said chip.
2 more elements
A chip package, comprising:
- a substrate having an active surface with a patterned circuit thereon;
- a semiconductor chip attached on said active surface of said substrate and electrically interconnected with said patterned circuit thereof;
- an inductor disposed between said substrate and said chip, said inductor includes:
- a lower winding disposed on said active surface of said substrate;
- a core made of a material with high permeability stacked over said lower winding;
- an upper winding disposed on said core;
- and
- said lower winding electrically interconnected with said upper winding to form an inductor coil;
- and
- an insulator cover encapsulating said inductor and said chip.
7 more elements
Dependencies are inferred from the claim text.