High power integrated circuit device

An integrated circuit (IC) device, comprising:

• a functional die comprising a substrate having a semiconducting surface, a first array of devices on and in said semiconducting surface, each of said devices in said first array comprising at least first and second coacting current conducting nodes, a plurality of layers disposed on said substrate, said plurality of layers comprising at a plurality of electrically conductive layers and a plurality of dielectric layers having a top surface, and a first plurality of bump pads on or in said top surface of said plurality of dielectric layers, wherein said plurality of electrically conductive layers comprise a first plurality of electrical traces, wherein at least a first portion of said first plurality of electrical traces electrically contact at least a first portion of said first plurality of bump pads exclusively to at least portion of said first coacting current conducting nodes, wherein at least a second portion of said first plurality of electrical traces electrically contact at least a second portion of said first plurality of bump pads exclusively to a at least portion of said second coacting current conducting nodes, and wherein said first plurality of electrical traces are electrically isolated from one another by said plurality of dielectric layers;
• and
• a workpiece having a workpiece surface facing said top surface, said workpiece comprising a plurality of electrically conductive contacts disposed on said workpiece surface, said plurality of electrically conductive contacts comprising a plurality of contact bands, each of said plurality of contact bands extending over at least a portion of said workpiece surface, each of said plurality of contact bands at least partially overlapping at least two of said first plurality of bump pad locations, and each of said plurality of contact bands physically and electrically contacting a portion of said first plurality of bump pads.

A method of designing an integrated circuit (IC) device, comprising:

• receiving a design for a functional die comprising a substrate having a semiconducting surface, a first array of devices on and in said semiconducting surface, each of said devices in said first array comprising at least first and second coacting current conducting nodes, a plurality of layers disposed on said substrate and comprising at a plurality of electrically conductive layers and a plurality of dielectric layers, and a first plurality of bump pads on or in said top surface of said plurality of dielectric layers at a plurality of first bump pad locations, wherein said plurality of electrically conductive layers comprise a first plurality of electrical traces, wherein at least a first portion of said first plurality of electrical traces electrically contact at least a first portion of said first plurality of bump pads exclusively to at least portion of said first coacting current conducting nodes, wherein at least a second portion of said first plurality of electrical traces electrically contact at least a second portion of said first plurality of bump pads exclusively to a at least portion of said second coacting current conducting nodes, and wherein said first plurality of electrical traces are electrically isolated from one another by said plurality of dielectric layers;;
• and
• determining an interconnection arrangement for said first plurality of devices;
• and
• selecting one of a plurality of a workpiece designs based on said interconnection arrangement, each of said workpiece designs defining a workpiece having a workpiece surface for mounting said functional die, said workpiece comprising a plurality of electrically conductive contacts disposed on said workpiece surface, said plurality of electrically conductive contacts comprising a plurality of contact bands, each of said plurality of contact bands extending over at least a portion of said workpiece surface, each of said plurality of contact bands at least partially overlapping at least two of said first bump pad locations for physically and electrically contacting said first bump pads, each of said plurality of workpiece designs specifying a different arrangement of said plurality of contact bands for providing a different interconnection arrangement of said first plurality of devices.