Premold housing having integrated vibration isolation
OwnerErich Ilich, Manfred Abendroth +1inventors
InventorsErich Ilich, Manfred Abendroth, Kurt Ingrisch
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Abstract
A premold housing for accommodating a chip structure in which a part of the housing that is connected to the chip structure is connected in a manner that permits elastic deflection to another part of the housing which is attached to the supporting structure bearing the entire housing, the two housing parts not contacting one another.
Claims11
1-10. (canceled)
A premold housing for accommodating a chip structure, comprising:
- a part of the housing, the part being connected to the chip structure and connected in a manner that permits elastic deflection to another part of the housing attached to the supporting structure bearing the entire housing, wherein the two housing parts do not contact each other.
The premold housing as recited in clam 12, wherein the elastically deformable medium is located in the intermediate space between the bottom plate and the part of the housing surrounding the bottom plate in a frame shape, the thickness of the elastically deformable medium not being greater than the thickness of the bottom plate.
Dependencies are inferred from the claim text.