Semiconductor structure and fabrication method thereof
AssigneeVanguard International Semiconductor Corporation
InventorsShang-Hui Tu, Hung-Shern Tsai
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AssigneeVanguard International Semiconductor Corporation
InventorsShang-Hui Tu, Hung-Shern Tsai
Estimating the term…
A method for fabrication of a semiconductor device is provided. A first type doped body region is formed in a first type substrate. A first type heavily-doped region is formed in the first type doped body region. A second type well region and second type bar regions are formed in the first type substrate with the second type bar regions between the second type well region and the first type doped body region. The first type doped body region, the second type well region, and each of the second type bar regions are separated from each other by the first type substrate. The second type bar regions are inter-diffused to form a second type continuous region adjoining the second type well region. A second type heavily-doped region is formed in the second type well region.
A method for forming a semiconductor structure, comprising:
A semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.