Trench metal oxide semiconductor field effect transistor (MOSFET) with low gate to drain coupled charges (Qgd) structures
AssigneeForce Mos Technology Co., Ltd.
InventorFwu-Iuan Hshieh
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AssigneeForce Mos Technology Co., Ltd.
InventorFwu-Iuan Hshieh
Estimating the term…
A trenched semiconductor power device includes a plurality of trenched gates surrounded by source regions near a top surface of a semiconductor substrate encompassed in body regions. The trenched semiconductor power device further comprises tilt-angle implanted body dopant regions surrounding a lower portion of trench sidewalls for reducing a gate-to-drain coupling charges Qgd between the trenched gates and a drain disposed at a bottom of the semiconductor substrate. The trenched semiconductor power device further includes a source dopant region disposed below a bottom surface of the trenched gates for functioning as a current path between the drain to the source for preventing a resistance increase caused by the body dopant regions surrounding the lower portions of the trench sidewalls.
A trenched semiconductor power device comprising a plurality of trenched gates surrounded by source regions near a top surface of a semiconductor substrate encompassed in body regions, said trenched semiconductor power device further comprising:
A method for manufacturing a trenched semiconductor power device on a semiconductor substrate comprising:
Dependencies are inferred from the claim text.