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US 2010/0163967 A1Published application
Flash Memory Device and Method of Fabricating the Same
AssigneeDongbu HiTek Co., Ltd.
InventorKi Jun YUN
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Abstract
A flash memory device and a method for fabricating the same are disclosed. The flash memory device includes an ONO layer on a substrate, polysilicon gates on the ONO layer, a gate oxide layer on the substrate, the ONO layer and the polysilicon gates, and a low temperature oxide layer and polysilicon sidewall spacers on outer side surfaces of the polysilicon gates, except in a region between nearest adjacent polysilicon gates.
Claims18
A method for fabricating a flash memory device comprising:
- forming an ONO layer and a first polysilicon layer on a substrate;
- patterning the first polysilicon layer and the ONO layer to form a plurality of floating gates;
- forming a gate oxide layer on or over the substrate and the plurality of floating gates;
- forming a resin on the substrate having the gate oxide layer thereon;
- removing a portion of the resin to expose the gate oxide layer, keeping a region between adjacent floating gates filled with the resin;
- removing the resin exposed by a photoresist pattern over resin between nearest adjacent floating gates;
- forming a second polysilicon layer on or over the floating gates and the resin;
- forming sidewall spacers on outer surfaces of the gate oxide by etching the second polysilicon layer;
- and
- removing the remaining resin between the nearest adjacent floating gates.
7 more elements
A flash memory device comprising:
- an ONO layer on a substrate;
- polysilicon gates on the ONO layer;
- a gate oxide layer on the substrate having the ONO layer and the polysilicon gates thereon;
- and
- a low temperature oxide layer and polysilicon sidewall spacers on outer surfaces of the polysilicon gates.
2 more elements
Dependencies are inferred from the claim text.