Semiconductor light emitting device

Abstract

A semiconductor light emitting device (A) includes a resin package (5), a semiconductor light emitting element (4), a first lead (1A) and a second lead (1B). The resin package (5) has an upper surface and a bottom surface, and has translucency. The semiconductor light emitting element (4) is covered with the resin package (5) in a state where the semiconductor light emitting element faces the upper surface of the resin package (5). The first lead (1A) includes a bonding pad (11A) which supports the semiconductor light emitting element (4). The second lead (1B) is separated from the first lead (1A), and is electrically connected to the semiconductor light emitting element (4) via a wire (6). The leads (1A, 1B) have mounting terminals (13A, 13B) which are exposed from the bottom surface of the resin package (5). The mounting terminals (13A, 13B) are surrounded by the resin package (5) in an in-plane direction perpendicular to the thickness direction of the resin package.

Dependencies are inferred from the claim text.