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US 2010/0163915 A1Published application
Thin-Film Semiconductor Component and Component Assembly
AssigneeOSRAM Opto Semiconductors GmbH
InventorsSiegfried Herrmann, Berthold Hahn
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Abstract
A thin-film semiconductor component having a carrier layer and a layer stack which is arranged on the carrier layer, the layer stack containing a semiconductor material and being provided for emitting radiation, wherein a heat dissipating layer provided for cooling the semiconductor component is applied on the carrier layer. A component assembly is also disclosed.
Claims15
A thin-film semiconductor component comprising:
- a carrier layer;
- a layer stack which is arranged on the carrier layer, the layer stack containing a semiconductor material and being provided for emitting radiation;
- and
- a heat dissipating layer provided for cooling the thin-film semiconductor component and applied on the carrier layer.
1 more element
Dependencies are inferred from the claim text.