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US 2010/0163869 A1Published application
Bonding inspection structure
AssigneesTaiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corp., Chi Mei Optoelectronics Corp., Industrial Technology Research Institute
InventorsSheng-Shu Yang, Hsiao-Ting Lee, Chao-Chyun An
Life of this patent
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Abstract
A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.
Claims35
A bonding inspection structure, disposed on a substrate, comprising:
- at least an elastic bump disposed on the substrate,
- wherein the elastic bump has at least an opening, and an inspection area of the top portion of the elastic bump is larger than an area of the opening.
A bonding structure, comprising:
- a first substrate;
- a second substrate;
- a bonding inspection structure located between the first substrate and the second substrate, the bonding inspection structure comprising:
- at least an elastic bump,
- wherein the elastic bump has at least an opening, and an inspection area of a top portion of the elastic bump is larger than an area of the opening;
- and
- a bonding material disposed around the bonding inspection structure to seal the first and the second substrates.
4 more elements
Dependencies are inferred from the claim text.