Resin Composition
AssigneeCheil Industries Inc.
InventorsSung Jun Kim, Young Sik Ryu
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Abstract
The present invention provides a resin composition comprising a thermoplastic resin (A), an inorganic compound having a volume resistance of less than about 10−3 Ω·m and relative permeability of more than about 5,000 (B) and fiber filler (C). The resin composition of the present invention can have high impact strength and high electrical conductivity, and high electromagnetic interference (EMI) and radio frequency interference (RFI) shielding properties. The resin composition of the present invention can accordingly have multiple functions and can be used for electrical/electronic devices.
Claims18
A resin composition comprising a thermoplastic resin (A), an inorganic compound (B) having a volume resistance of less than about 10−3 Ω·m and a relative permeability of more than about 5,000 and a fiber filler (C).
Dependencies are inferred from the claim text.