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US 2010/0163686 A1Published application
Double impedance bond
AssigneeMag-Con Engineering
InventorDennis Sando
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AssigneeMag-Con Engineering
InventorDennis Sando
Estimating the term…
A low profile double impedance bond for placement between a pair of rails and for electrical connection to opposite sides of a pair of insulated breaks on the pair of rails, the impedance bond comprising a rectangular enclosure attachable to ties supporting the pair of rails, the enclosure having a pair of ends and a pair of sides, each side for alignment parallel to one of the rails, the impedance bond having four coils each formed of a strip of copper foil with two ends wound in a spiral configuration about a core, the impedance bond having a terminal connection array formed of a plurality of copper conductors, the conductors, cores, and coils are arranged in a low profile manner on a single platform allowing quick installation inbetween rails.
A low profile double impedance bond for connection to opposite sides of a pair of insulated breaks on a pair of rails, the impedance bond comprising a rectangular enclosure configured for placement intermediate the pair of rails and attachable to ties supporting the rails, the enclosure including a bottom plate portion, the impedance bond further comprising a first coil assembly and a second coil assembly, each of the coil assemblies mounted to the bottom plate portion, each of the coil assemblies having a stacked UI core with a first coil and a second coil wound around the stacked UI core, each coil having a winding of copper sheet material with two ends and a pair of terminals straps soldered to the ends of the copper sheet material, each of the terminal straps having a rectangular cross-section and having a solder portion and a terminal connection portion, one of the terminal straps configured as a rail connection terminal strap and extending out of the end of the enclosure and the other configured as a centertap connection terminal strap and extending in an inboard direction for electrical connection with the other centertap connection terminal straps, the rail connection terminal strap extending out of the enclosure having its solder portion positioned proximate the core and having the winding of the copper sheet material extending over said terminal strap thereby providing structural support.
A low profile double impedance bond for placement between a pair of rails and for electrical connection to opposite sides of a pair of insulated breaks on the pair of rails, the impedance bond comprising a rectangular enclosure attachable to ties supporting the pair of rails, the enclosure having a pair of ends and a pair of sides, each side for alignment parallel to one of the rails, the impedance bond having four coils each formed of a strip of copper foil with two ends wound in a spiral configuration about a core, the impedance bond having a terminal connection array formed of a plurality of copper conductors, each having a rectangular cross section, the plurality of copper conductors all in a coplanar alignment.
A low profile double impedance bond for placement between a pair of rails and for electrical connection to opposite sides of a pair of insulated breaks on the pair of rails, the impedance bond comprising a rectangular enclosure attachable to ties supporting the pair of rails, the enclosure having a pair of ends and a pair of sides, each side for alignment parallel to one of the rails, the impedance bond having two coil assemblies, each coil assembly formed of two coils disposed on a single core, each coil formed of a strip of copper foil with two ends and wound in a spiral configuration about the core, the core formed of a plurality of layers, each layer having a C shaped piece of sheet metal and an I shaped piece of sheet metal to form a UI configuration layer, a plurality of the UI configuration layer stacked on one another.
Dependencies are inferred from the claim text.