Electrochemical planarization system comprising enhanced electrolyte flow
AssigneeGlobalfoundries Inc.
InventorsAxel Kiesel, Johannes Groschopf
Life of this patent
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Abstract
A polishing pad for an electrochemical planarization tool comprises a patterned surface that forms appropriate electrolyte flow channels for directing an electrolyte from the center to the periphery thereof. Consequently, a continuous electrolyte flow may be established, thereby significantly reducing the accumulation of contaminants in the polishing pad, thereby contributing to enhanced process uniformity so that frequent rinsing of the polishing pad and replacement of the electrolyte solution may be avoided.
Claims21
A method of removing a metal from a substrate surface, the method comprising:
- moving a substrate surface of a first substrate relative to a polishing pad, said polishing pad having protruding surface areas;
- electrically connecting said substrate surface with an anode;
- supplying an electrolyte between said polishing pad and said substrate surface;
- and
- establishing a continuous electrolyte flow to a periphery of said polishing pad so as to electrically contact a cathode by said continuous electrolyte flow.
A pad for an electrochemical planarization tool, the pad comprising:
- a patterned pad surface to be positioned against a substrate surface to be treated, said patterned pad surface comprising at least some electrically conductive protruding areas;
- and
- a plurality of electrolyte flow channels formed in said patterned pad surface, each of said plurality of electrolyte flow channels terminating at an edge of said patterned pad surface.
An electrochemical planarization tool, comprising:
- a platen configured to receive a polishing pad;
- a substrate carrier configured to receive a substrate having a surface to be planarized;
- a drive assembly configured to establish a relative motion between said substrate and said platen;
- a polishing pad attached to said platen and comprising a patterned surface so as to form a plurality of electrolyte flow channels, each electrolyte flow channel terminating at a periphery of said patterned surface;
- a container configured to accommodate said platen and an electrolyte bath;
- an electrolyte supply unit configured to supply an electrolyte to said patterned surface of the polishing pad;
- and
- a voltage supply unit configured to apply a voltage across said surface to be planarized and said electrolyte bath.
Dependencies are inferred from the claim text.