Substrate support in a reactive sputter chamber

An apparatus for depositing a transparent conductive oxide layer, comprising:

• a processing chamber having an interior processing region and two substrate transfer ports;
• a substrate carrier system disposed in the interior processing region, the substrate carrier system having a plurality of rollers for conveying substrate between the transfer ports through the interior processing region;
• a plurality of PVD targets disposed in the processing chamber and facing the substrate carrier system;
• and
• an insulating member electrically isolating the rollers from the processing chamber.

A method of sputter depositing a transparent conductive oxide layer, comprising:

• positioning a substrate on a substrate carrier system disposed in a processing chamber;
• sputtering source material from a target disposed in the processing chamber as the substrate advances on the substrate carrier system;
• and
• electrically floating the substrate from ground during sputtering.