Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof

A method for manufacturing multi-coaxial leads within a single via in a circuit substrate comprising:

• preparing a first substrate, having a first ground metal on top and a first through hole;
• preparing a second substrate, having a base metal layer on top;
• stacking said first substrate on said base metal layer of said second substrate;
• forming a vertical metal in said first through hole;
• etching said vertical metal to form at least a first annular space encircling a first central lead and a second annular space encircling a second central lead;
• and
• forming vertical insulators in said first and second annular spaces to form a plurality of first coaxial leads and a second coaxial leads.