Coaxial plated through holes (pth) for robust electrical performance
AssigneeIntel Corporation
InventorsMihir Roy, Mahadevan Suryakumar, Yonggang Li
Life of this patent
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Abstract
In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. In this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed and claimed.
Claims19
An apparatus comprising:
- an integrated circuit device;
- and
- a substrate coupled with the integrated circuit device, wherein the substrate includes:
- a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire;
- and
- conductive traces to separately route the plated through hole and the coaxial copper wire.
An electronic appliance comprising:
- a network controller;
- a system memory;
- and
- a processor, wherein the processor comprises:
- an integrated circuit device;
- and
- a substrate coupled with the integrated circuit device, wherein the substrate includes
- a plated through hole;
- dielectric material filling the plated through hole;
- a coaxial wire within the dielectric material;
- and
- conductive traces separately routing the plated through hole and the coaxial copper wire to contacts of the integrated circuit device.
A method comprising:
- drilling a through hole in a substrate core;
- plating the drilled through hole;
- filling the plated through hole with dielectric material and a coaxial copper wire;
- patterning a surface of the substrate core to route the plated through hole and the copper wire;
- and
- forming build-up layers on the patterned surface to form a substrate.
Dependencies are inferred from the claim text.