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US 2010/0163291 A1Published application
Substrate embedded with passive device
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung-Hyun CHO, Il-Soung YOON, Won-Cheol BAE, Se-Jong OH
Life of this patent
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Abstract
A substrate embedded with a passive device, including a substrate, on which a cavity is formed; a passive device in the cavity, the passive being pre-molded; and a conductive material for adhering the passive device to the cavity, the conductive material being laminated on the cavity.
Claims5
A substrate embedded with a passive device, comprising:
- a substrate, on which a cavity is formed;
- a passive device in the cavity, the passive being pre-molded;
- and
- a conductive material for adhering the passive device to the cavity, the conductive material being laminated on the cavity.
1 more element
Dependencies are inferred from the claim text.