Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board
AssigneeFujikura Ltd.
InventorsShoji ITO, Tomofumi Kitada, Tadanori Ominato
Life of this patent
Estimating the term…
Abstract
A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.
Claims15
A printed wiring board comprising:
- an insulated substrate;
- a conductive circuit provided on one side of this insulated substrate;
- a cover layer covering the insulated substrate and the conductive circuit;
- and
- a conductive particle buried in this cover layer, wherein
- the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer;
- and
- the conductive particle serves as an electric contact point.
A connection method of a printed wiring board connecting
- a first printed wiring board comprising an insulated substrate, a conductive circuit provided on one side of this insulated substrate, a cover layer covering the insulated substrate and the conductive circuit, and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer;
- and
- a second printed wiring board comprising an insulated substrate, a conductive circuit provided on one side of this insulated substrate, a cover layer covering the insulated substrate and the conductive circuit, wherein at least a part of the conductive circuit is exposed;
- the connection method comprising:
- a step contacting the conductive particle of the first printed wiring board with the conductive circuit of the second printed wiring board;
- and
- a step bonding a contacting portion of the conductive particle and the conductive circuit, as well as an area surrounding the contacting portion, with an adhesive.
A manufacturing method of a printed wiring board comprising an insulated substrate, a conductive circuit provided on one side of this insulated substrate, a cover layer covering the insulated substrate and the conductive circuit, and a conductive particle buried in this cover layer, the manufacturing method comprising:
- a step providing the conductive circuit on one side of the insulated substrate;
- a step providing the conductive particle on a side opposite to a side at which the conductive circuit contacts the insulated substrate;
- a step providing the cover layer so that at least a top portion of the conductive particle is exposed, and the cover layer covers the insulated substrate and the conductive circuit.
A manufacturing method of a printed wiring board comprising an insulated substrate, a conductive circuit provided on one side of this insulated substrate, a cover layer covering the insulated substrate and the conductive circuit, and a conductive particle buried in this cover layer, the manufacturing method comprising:
- a step providing the conductive circuit on one side of the insulated substrate;
- a step using a coverlay film as a material of the cover layer and providing a pore on this coverlay film;
- a step packing the conductive particle in the pore so that at least a top portion of the conductive particle is exposed;
- and
- a step bonding the coverlay film, in which the conductive particle is packed, with the insulated substrate, on which the conductive circuit is provided, so that the conductive particle contacts the conductive circuit.
Dependencies are inferred from the claim text.