High-rate groove pattern
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorGregory P. Muldowney
Life of this patent
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AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorGregory P. Muldowney
Estimating the term…
The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The polishing pad comprises a center, an inner region surrounding the center, a transition region connecting grooves from the inner region to an outer region surrounding the inner region. The outer region has multiple grooves with a high-rate path. The transition region is adjacent the outer region and within a radius from the center defined as follows: r TR = 0.7 r * to 1.3 r * where r * = R C ( R R C ) 2 - cos ( 2 θ c 0 ) - sin ( 2 θ c 0 ) ( R / R c cos θ c 0 ) 2 - 1 ; with the inner region originating continuous grooves that extend uninterrupted to the outer region.
A polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad, the polishing pad comprising:
A polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad, the polishing pad comprising:
Dependencies are inferred from the claim text.