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US 2010/0148792 A1Published application
Heat sink structure and test head with same
AssigneeAdvantest Corporation
InventorKoei NISHIURA
Life of this patent
Estimating the term…
Abstract
To provide a heat sink structure able to improve the heat radiation efficiency without thickening of the heat sink. A heat sink structure comprises a plate-shaped heat sink 40 having a top surface 41 and a bottom surface 42, wherein through holes 43 to 45 along a planar direction of a board 21 are formed between the top surface 41 and the bottom surface 42 of the heat sink 40.
Claims14
A heat sink structure for cooling an electronic device mounted on a board,
- the heat sink structure comprising a plate-shaped heat sink having a top surface and a bottom surface, wherein
- a through hole penetrating along a planar direction of the board is formed between the top surface and the bottom surface of the heat sink.
A heat sink structure for cooling an electronic device mounted on a board,
- the heat sink structure comprising a heat sink having a plurality of plates stacked on each other, wherein
- a through hole penetrating along a planar direction of the board is provided between the plurality of plates.
Dependencies are inferred from the claim text.