Semiconductor device and method of manufacturing the same

A method of manufacturing a semiconductor device, the method comprising:

• (a) half-dicing a semiconductor wafer comprising a plurality of semiconductor chips, thereby forming dicing grooves in the semiconductor wafer, wherein each of the semiconductor chips includes a semiconductor integrated circuit and pads and wherein the semiconductor wafer includes:
• a first surface on which the semiconductor integrated circuit and the pads are formed;
• and a second surface opposite to the first surface,
• (b) connecting the pads to each other by conductive connectors;
• (c) sealing the first surface of the semiconductor wafer, the dicing grooves and the conductive connectors with a resin;
• (d) grinding the second surface of the semiconductor wafer, thereby forming a group of sealed chips, in which bodies of the semiconductor chips are separated from each other and are bonded by the resin;
• (e) dividing the group of sealed chips into individual sealed chips;
• (f) mounting and stacking the individual sealed chips on a wiring substrate having connection terminals thereon, thereby forming a semiconductor chip stack;
• and
• (g) electrically-connecting the conductive connectors and the connection terminals using a conductive member, wherein the conductive connectors are extended through side surfaces of each of the individual sealed chips.