Semiconductor device

Abstract

Patterns provided on a surface of a substrate include an adhesion area pattern and one or more non-adhesion area patterns. A chip electrode on a backside of a semiconductor chip is attached to the adhesion area pattern by a conductive adhesive. Consequently, an area of patterns subjected to gold plating that is stable in a steady state is smaller in a substrate of the present invention than in a conventional substrate, resulting in reduction in costs. Further, the chip electrode is attached to the adhesion area pattern by a conductive adhesive in a liquid form. Consequently, a semiconductor device of the present invention allows reducing use of an expensive conductive adhesive compared with a conventional semiconductor device, resulting in reduction in costs.

Dependencies are inferred from the claim text.