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US 2010/0148251 A1Published application
Semiconductor device and method for manufacturing the same
AssigneeDongbu HiTek Co., Ltd.
InventorHyon-Chol Lim
Life of this patent
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Abstract
A semiconductor device includes: a substrate on and/or over which a first conductive type well is formed; and an LDMOS device that includes a gate electrode and has a drain region formed in the substrate. The LDMOS device includes a trench formed on the substrate, a second conductive type body that is formed on one side of the trench and on the substrate therebeneath, and a first conductive type source region that is formed in the second conductive type body.
Claims20
An apparatus, comprising:
- a substrate over which a first conductive type well is formed;
- and
- an LDMOS device that includes a gate electrode and a drain region formed in the substrate, wherein the LDMOS device includes a trench formed over the substrate, a second conductive type body formed on one side of the trench and over the substrate therebeneath, and a first conductive type source region formed in the second conductive type body.
An apparatus, comprising:
- a substrate over which a device isolation layer, a first conductive type well, and a drain region are formed;
- a trench formed by etching a portion of the substrate;
- a second conductive type body formed in the substrate in a shape enclosing the trench;
- a first conductive type source region and a second conductive type contact region, both formed in the second conductive type body;
- and
- a first gate electrode formed over the substrate and of which at least a portion is formed in the trench.
3 more elements
A method, comprising:
- implanting impurity in a substrate over which a first conductive type deep well is formed;
- forming a trench by etching a portion of the substrate;
- forming a second conductive type body on one side of the trench and a lower substrate;
- forming a polysilicon over an upper side of the substrate and in the trench;
- forming first and second gate electrodes by patterning the polysilicon;
- and
- forming a first conductive type source region and drain region in the substrate.
4 more elements
Dependencies are inferred from the claim text.