Chemical mechanical polishing method
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-Keun Kim, Chung-Ki Min, Yong-Sun Ko, Kyung-Hyun Kim
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Abstract
In an embodiment, a chemical mechanical polishing method for a substrate having a first layer and a stepped portion. A surface of the first layer is positioned above an upper face of the stepped portion. A polishing process for selectively removing the stepped portion is performed on the first layer by using a first slurry composition that has a self-stopping characteristic so that the first layer is changed into a second layer having a substantially flat surface. A second polishing process is performed using a second slurry composition that does not have the self-stopping characteristic, until the upper face of the stepped portion is exposed.
Claims19
A method of chemical mechanical polishing a substrate of a type comprising:
- a first stepped portion having an upper face;
- and
- a first layer on the substrate, the first layer including a stepped portion, the stepped portion formed over, and substantially conforming to, the first stepped portion, the method comprising:
- performing a first polishing process on the stepped portion of the first layer using a slurry composition having a pH value at which a zeta potential of the first layer is negative to change the first layer into a second layer having a substantially flat surface, the second layer covering the upper face of the first stepped portion;
- and
- performing a second polishing process on the second layer until the upper face of the first stepped portion is exposed.
A method of chemical mechanical polishing a substrate of a type comprising:
- a first stepped portion having a first upper face, a first lower face positioned below the first upper face, and a first sidewall between the first upper face and the first lower face;
- and
- a first layer on the substrate, the first layer including a stepped portion, the stepped portion formed over the first stepped portion, the stepped portion substantially conforming to the first stepped portion, the first upper face of the first stepped portion positioned below the first layer, the method comprising:
- performing a first polishing process on the stepped portion of the first layer using a slurry composition having a pH value at which a zeta potential of the first layer is negative to change the first layer into a second layer having a substantially flat surface, the second layer covering the first upper face, the slurry composition including a surfactant having an anionic polymer.
A method of chemical mechanical polishing a substrate of a type comprising:
- a first stepped portion having a first upper face, a first lower face positioned below the first upper face, and a first sidewall between the first upper face and the first lower face and a second stepped portion having a second upper face, a second lower face positioned below the second upper face, and a second sidewall between the second upper face and the second lower face, the first lower face corresponding to the second upper face;
- and
- a first layer on the substrate, the first layer including a stepped portion, the stepped portion formed over the first stepped portion and the second stepped portion, the stepped portion substantially conforming to the first stepped portion and the second stepped portion, the first upper face of the first stepped portion positioned below the first layer, the method comprising:
- performing a first polishing process on the stepped portion of the first layer using a slurry composition including about 2 to about 3 percent by weight of a surfactant having an anionic polymer to change the first layer into a second layer having a substantially flat surface, the second layer covering the first upper face of the first stepped portion, the slurry composition having a pH value at which a zeta potential of the first layer is negative;
- and
- performing a second polishing process on the second layer until the first upper face of the first stepped portion is exposed.
Dependencies are inferred from the claim text.