Substrate plasma treatment using magnetic mask device

A method for the treatment of a substrate surface, the method comprising:

• (a) providing a dielectric barrier discharge electrode structure for generating an atmospheric pressure plasma in a treatment space between a first electrode and a second electrode,
• (b) providing a magnetic layer on a surface of at least the first electrode,
• (c) contacting a substrate with the magnetic layer,
• (d) contacting a mask device with the substrate, the mask device interacting with the magnetic layer, and
• (e) applying a plasma generating power to the first and second electrodes thereby treating a surface of the substrate exposed by the mask device.

A plasma treatment apparatus for treatment of a surface of a substrate, comprising:

• (a) a dielectric barrier discharge electrode structure having a treatment space and comprising a first electrode and a second electrode,
• (b) a power supply connected to the first electrode and the second electrode for generating an atmospheric pressure plasma in the treatment space, and
• (c) a magnetic layer provided on a surface of at least the first electrode,
• the first electrode being arranged to receive, in operation, the substrate to be treated and a mask device in contact with the substrate, the mask device interacting with the magnetic layer.