Method for producing conductive substrate and conductive substrate
AssigneeTorqy Industries, Inc., a corporation of Japan
InventorsShotaro Tanaka, Junpei Ohashi, Yasushi Takada
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Abstract
A method produces a conductive substrate wherein a metal fine particle layer is laminated onto at least one surface of a base in a network form. This method includes a step for treating the metal fine particle layer with an organic solvent; and a following step for treating the metal fine particle layer with an acid. Also disclosed is a conductive substrate produced by such a method. This method enables to produce a conductive substrate, which has transparency and high conductivity and is thus suitable for electromagnetic shielding films and the like, with high productivity.
Claims14
A method for producing a conductive substrate wherein a metal fine particle layer is laminated onto at least one surface of a base in a network form, comprising the steps of:
- treating said metal fine particle layer with an organic solvent;
- and
- thereafter, treating said metal fine particle layer with an acid.
A method for producing a conductive substrate comprising:
- laminating a metal fine particle layer onto at least one surface of a base in a network form;
- treating the metal fine particle layer with an organic solvent;
- and
- treating the metal fine particle layer with an acid.
Dependencies are inferred from the claim text.