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US 2010/0147502 A1Published application
Heat dissipation device with heat pipe
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsSHOU-BIAO XU, SHI-WEN ZHOU, CHUN-CHI CHEN
Life of this patent
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Abstract
A heat dissipation device includes a heat pipe. The heat pipe includes an evaporating section connecting with a heat spreader, a condensing section connecting with a fin assembly, and a connecting section interconnecting the evaporating section and the condensing section. The evaporating section of the heat pipe has a diameter smaller than that of the condensing section.
Claims15
A heat dissipation device, comprising:
- a fin assembly;
- a heat spreader;
- and
- a heat pipe comprising an evaporating section, a condensing section, a connecting section interconnecting the evaporating section and the condensing section, wherein the evaporating section of the heat pipe has a diameter smaller than that of the condensing section, the evaporating section connecting with the heat spreader, the condensing section connecting with the fin assembly.
1 more element
A heat dissipation device, comprising:
- a heat spreader having a plurality of ears each being mounted with a fastener;
- a fin assembly;
- and
- at least one heat pipe comprising an evaporating section contacting the heat spreader, and a condensing section contacting the fin assembly, wherein the evaporating section is smaller than the condensing section.
1 more element
Dependencies are inferred from the claim text.