Measuring apparatus
AssigneeMetryx Limited
InventorsRobert John Wilby, Adrian Kiermasz
Life of this patent
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Abstract
Measuring apparatus and method for monitoring fabrication of a semiconductor wafer by exciting and measuring vibrations of the wafer substrate. A measurable parameter of vibration (e.g. frequency) is indicative of mass of a vibrating region. Mass change caused by wafer treatment is reflected in changes in vibration measurements taken before and after that treatment. The apparatus includes a wafer support e.g. projecting ledge (19), a vibration exciting device e.g. contact probe (28) or pressure differential applicator, and a measurement device e.g. frequency sensor (62).
Claims22
Apparatus for monitoring a fabrication process of a semiconductor wafer, the apparatus including:
- a wafer support arranged to support the wafer;
- a vibration exciting device arranged to vibrate the wafer;
- and
- a measurement device for measuring the wafer vibrations at one or more measurement positions to determine one or more properties of the wafer.
A method of monitoring a mass distribution of a semiconductor wafer during a fabrication process, the method including:
- supporting the wafer on a wafer support;
- vibrating the wafer;
- and
- measuring the vibrations at one or more measurement positions.
A method of monitoring a mass distribution of a semiconductor wafer during a fabrication process, the method comprising:
- exciting and measuring a frequency of localized vibrations at a plurality of measurement positions on a wafer substrate before wafer treatment;
- treating the wafer;
- exciting and measuring a frequency of localized vibrations at a plurality of measurement positions on the substrate after wafer treatment;
- and
- comparing the measurement results.
Dependencies are inferred from the claim text.