Predicting Wafer Failure Using Learned Probability
AssigneeInternational Business Machines Corporation
InventorsRobert Jeffrey Baseman, Susan G. Conti, William A. Muth, Michal Rosen-Zvi, Frederick A. Scholl
Life of this patent
Estimating the term…
Abstract
Techniques for estimating a quality of one or more wafers are presented. One or more first wafers comprising one or more first dies are tested. A probability of wafer failure is determined in accordance with one or more first test measurements of the one or more first dies. A pass status and/or a fail status of one or more second wafers is inferred by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure.
Claims17
A method for estimating a quality of one or more wafers, the method comprising:
- testing one or more first wafers comprising one or more first dies;
- determining a probability of wafer failure in accordance with one or more first test measurements of the one or more first dies;
- and
- inferring at least one of a pass status and a fail status of one or more second wafers by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure.
An apparatus for estimating a quality of one or more wafers, the apparatus comprising:
- a memory;
- and
- at least one processor coupled to the memory and operative to:
- test one or more first wafers comprising one or more first dies;
- determine a probability of wafer failure in accordance with one or more first test measurements of the one or more first dies;
- and infer at least one of a pass status and a fail status of one or more second wafers by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure.
A computer program product for estimating a quality of one or more wafers, the computer program product comprising:
- a computer-readable medium;
- a first program instruction to test one or more first wafers comprising one or more first dies;
- a second program instruction to determine a probability of wafer failure in accordance with one or more first test measurements of the one or more first dies;
- and
- a third program instruction to infer at least one of a pass status and a fail status of one or more second wafers by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure,
- wherein the first, second, and third program instructions are stored on the computer-readable medium.
Dependencies are inferred from the claim text.