Method of manufacturing semiconductor device
AssigneePanasonic Corporation
InventorHideaki Okamura
Life of this patent
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Abstract
A SiOC film 7 exposed at the bottom of a contact hole 11 is changed to an altered layer 12 after the contact hole 11 is formed, so that a selection ratio of the altered layer 12 and a semiconductor substrate 1 can be increased and the altered layer 12 can be selectively removed by etching. Thus it is possible to suppress an amount of etching on a base substrate and form a contact while suppressing leakage from the substrate even when stacked layers are displaced from each other.
Claims4
A method of manufacturing a semiconductor device, when a contact is formed on the semiconductor device, the method comprising:
- forming one of a semiconductor element and wiring on a semiconductor substrate;
- stacking a SiOC film over the semiconductor substrate including a top surface of the semiconductor element and a top surface of the wiring;
- stacking an interlayer insulating film on the SiOC film;
- stacking an antireflection coating on the interlayer insulating film;
- applying photosensitive resin on the antireflection coating and then forming an opening in a contact hole formation region of the photosensitive resin to form a pattern of a contact hole;
- forming the contact hole by dry etching the antireflection coating and the interlayer insulating film according to a pattern of the photosensitive resin until a surface of the SiOC film is exposed;
- irradiating the overall semiconductor substrate with oxygen gas plasma to alter an exposed part of the SiOC film to an altered layer;
- dry etching the altered layer to expose a surface of the semiconductor substrate;
- removing the photosensitive resin and the antireflection coating;
- and
- charging a conductive material into the contact hole to form the contact.
A method of manufacturing a semiconductor device, when a contact is formed on the semiconductor device, the method comprising:
- forming one of a semiconductor element and wiring on a semiconductor substrate;
- stacking a SiOC film over the semiconductor substrate including one of a top surface of the semiconductor element and a top surface of the wiring;
- stacking an interlayer insulating film on the SiOC film;
- stacking an antireflection coating on the interlayer insulating film;
- applying photosensitive resin on the antireflection coating and then forming an opening in a contact hole formation region of the photosensitive resin to form a pattern of a contact hole;
- forming the contact hole by dry etching the antireflection coating and the interlayer insulating film according to a pattern of the photosensitive resin until a surface of the SiOC film is exposed;
- removing the photosensitive resin and the antireflection coating while irradiating the overall semiconductor substrate with oxygen gas plasma to alter an exposed part of the SiOC film to an altered layer;
- dry etching the altered layer to expose a surface of the semiconductor substrate;
- and
- charging a conductive material into the contact hole to form the contact.
Dependencies are inferred from the claim text.