Surface-treated metal substrate and manufacturing method of the same

A manufacturing method of a surface-treated metal substrate, comprising the steps of:

• forming by sputtering an adhesive layer directly adhered to a passivation film of the metal substrate, with an internal residual stress of this adhesive layer set as a compression stress or a zero stress, and
• forming on the adhesive layer by sputtering a bonding layer mainly composed of any one of copper (Cu), a mixture state of copper and nickel (Cu—Ni), a mixture state of copper and zinc (Cu—Zn), and a mixture state of copper, nickel, and zinc (Cu—Ni—Zn),
• wherein in the step of forming the adhesive layer and the step of forming the bonding layer, film formation by sputtering is performed sequentially in the same chamber maintaining a film formation atmosphere of inactive gas from which oxygen is intentionally removed even when materials of the formed layers are switched.