Film Formation Method and Method for Manufacturing Light-Emitting Element
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorKoichiro Tanaka
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorKoichiro Tanaka
Estimating the term…
There is a problem in a method for forming an EL layer by heating with light and transferring an organic material in that the organic material is not uniformly transferred. The present invention relates to a film formation method including the steps of forming a metal film over a first surface of an elastic substrate; forming an organic material layer onto a second surface of the elastic substrate which is opposite to the first surface; placing the second surface of the elastic substrate and a substrate on which a film is to be formed, with a space between the second surface of the elastic substrate and the substrate on which a film is to be formed; heating locally and rapidly the metal film from a first surface side of the elastic substrate to deform the elastic substrate by expansion of the metal film; and transferring the organic material layer from the elastic substrate onto the substrate on which a film is to be formed.
A film formation method comprising the steps of:
A method for manufacturing a light-emitting device comprising the steps of:
Dependencies are inferred from the claim text.