Back to results
US 2010/0142169 A1Published application
Electronic device and process for manufacturing electronic device
AssigneeNEC Electronics Corporation
InventorsKenji UCHIDA, Koki Hirasawa
Life of this patent
Estimating the term…
Abstract
The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.
Claims9
An electronic device, comprising:
- an element formed in a wafer;
- a frame member, composed of a first resin and installed over said wafer to surround a functional unit of said element;
- and
- a resin layer, composed of a second resin, and provided so as to fill the circumference of said frame member so that a gap is present between said frame member and said resin layer.
1 more element
A process for manufacturing an electronic device, including:
- forming a frame member over a wafer having a plurality of elements formed therein, said frame member being composed of a first resin and being installed over said wafer to surround a functional unit of said element;
- deforming said frame member so as to enlarge a width of said frame member by pressing a molding surface of a metallic mold for an encapsulation against an upper surface of said frame member;
- injecting the second resin into the interior of said encapsulating metallic mold while said frame member is deformed;
- and
- disassembling said encapsulating metallic mold to deform the enlarged width of said frame member again, returning to the previous dimension.
2 more elements
Dependencies are inferred from the claim text.