US 2010/0142154 A1 · Thermally Dissipative Enclosure Having Shock Absorbing Properties

Abstract

A thermally dissipative housing (200) includes a rigid housing (203) and a compliant heat spreader (215). The compliant heat spreader (215) is thermally coupled to a heat-generating component (201) disposed within the thermally dissipative housing (200). The compliant heat spreader (215) removes heat from the heat-generating component (201) and transfers it along an interior surface of the rigid housing (203) by passing along an interior (209) of the rigid housing (203) across at least a portion of the interior surface area (211) of the rigid housing (203). The compliant heat spreader (215) transfers heat to the surface of the rigid housing (203) without substantially interfering with the shock absorbing properties of the rigid housing (203).

Claims20

Dependent claims

A thermally dissipative housing for heat generating electronic components, the thermally dissipative housing comprising:

a rigid housing having an interior and an exterior, the interior having an interior surface area;
a printed circuit board disposed within the rigid housing, the printed circuit board comprising one or more of the heat generating electronic components;
and
a compliant heat spreader thermally coupled to the one or more of the heat generating electronic components, the compliant heat spreader passing along the interior of the rigid housing across at least twenty-five percent of the interior surface area.

1 more element

Dependencies are inferred from the claim text.

Thermally Dissipative Enclosure Having Shock Absorbing Properties

Life of this patent

Thermally Dissipative Enclosure Having Shock Absorbing Properties

Life of this patent

Abstract

Claims20