Method of manufacturing piezoelectric oscillating pieces, piezoelectric oscillating piece, and piezoelectric resonator
AssigneeNihon Dempa Kogyo Co., Ltd.
InventorsTakehiro Takahashi, Masahiro Yoshimatsu
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AssigneeNihon Dempa Kogyo Co., Ltd.
InventorsTakehiro Takahashi, Masahiro Yoshimatsu
Estimating the term…
Wafer-level processing of making outer peripheral ends (beveled portions) of piezoelectric oscillating pieces thinner than center portion sides is made possible easily and at low cost. A metal film which is a mask of a piezoelectric substrate and a photoresist film which is a mask of the metal film and has a pattern with which connection support portions supporting piezoelectric oscillating pieces on the piezoelectric substrate are formed are stacked on the piezoelectric substrate in this order from the substrate side, and by etching with the photoresist film and the metal film used as masks, contours of the plural piezoelectric oscillating pieces are formed in the piezoelectric substrate. Then, from a direction of through spaces (side surfaces) formed by this etching, the metal film is etched with an etching solution without peeling off the photoresist film, whereby outer peripheral sides of the metal film are removed and surfaces of outer peripheral ends of the piezoelectric oscillating pieces are exposed, and the exposed surfaces are etched with an etching solution, whereby the piezoelectric oscillating pieces are processed so that outer peripheral ends thereof become thinner than inner peripheral sides.
A method of manufacturing piezoelectric oscillating pieces, comprising:
Dependencies are inferred from the claim text.