Semiconductor die interconnect formed by aerosol application of electrically conductive material

An assembly of stacked die, each die having an active side, an interconnect margin and an interconnect sidewall adjacent an interconnect edge and having interconnect pads arranged in the interconnect margin;

• the assembly including
• a stack of the die in which successive die in the stack are separated by spacers, and in which the die are arranged so that the interconnect sidewalls are situated generally in a plane perpendicular to the plane of the active side of the die and the spacers are offset in relation to the interconnect edges;
• and
• an interconnect terminal constituting a line formed from interconnect pads to and over the interconnect edge and over the interconnect sidewall.

An electrically interconnected offset stacked die assembly, comprising

• a die and an underlying feature, the die having an interconnect pad at an interconnect sidewall, the die sidewall and a surface of the underlying feature forming an inside angle;
• a fillet at the inside angle formed by a die sidewall and the surface of the underlying feature, the fillet having a sloping surface;
• and
• an interconnect trace contacting the pad and passing over the surface of the fillet.

An electrically interconnected offset stacked die assembly, comprising

• a substrate, a bottom die mounted on the substrate, and a first upper die;
• a first fillet formed at a first inside angle formed by a sidewall of the bottom die and a surface of a substrate;
• a first set of electrical interconnect traces connecting pads on the bottom die with bond pads in a first row on the substrate and passing over a sloping surface of the first underfill;
• and
• a second fillet formed over the first interconnect traces on the first fillet and at a second angle formed by a sidewall of the first upper die and a surface of the bottom die inboard from the pads on the bottom die;
• and
• a second set of electrical interconnect traces connecting die pads on the first upper die to bond pads in a second row, outboard from the first row, on the substrate.

An electrically interconnected offset stacked die assembly, comprising

• a first die having a sidewall, and an underlying feature having a surface, the die sidewall and the surface meeting at a first inside angle;
• a first fillet formed at the first inside angle;
• and
• a first set of electrical interconnect traces contacting pads on the first die and passing over a sloping surface of the first fillet.