Back to results
US 2010/0140810 A1Published application
Chip package with coplanarity controlling feature
AssigneeSTMicroelectronics Asia Pacific Pte Ltd
InventorJing-en Luan
Life of this patent
Estimating the term…
Abstract
A chip package includes a substrate, an integrated circuit proximate a top surface of the substrate, and a cap comprising encapsulant that encapsulates the integrated circuit on at least a portion of the top surface of the substrate. The chip package further includes at least one extension feature positioned on at least a portion of the top surface of the substrate. The at least one extension feature also comprises the encapsulant and extends from the cap to a perimeter of the substrate.
Claims19
A method of manufacturing a chip package, the method comprising:
- placing an integrated circuit proximate a top surface of a substrate, the substrate having a plurality of top bond pads and a plurality of bottom bond pads;
- forming electrical connections between the integrated circuit and a first subset of the plurality of top bond pads;
- encapsulating the integrated circuit in an encapsulant to form a cap on at least a portion of the top surface of the substrate, the substrate having a second subset of the plurality of top bond pads positioned outside of a perimeter of the cap;
- and
- forming at least one extension feature from the encapsulant on at least a portion of the top surface of the substrate, the at least one extension feature extending from the cap to a perimeter of the substrate, and the substrate having at least two bond pads of the second subset not covered by the at least one extension feature.
2 more elements
A chip package, comprising:
- a substrate having a plurality of top bond pads and a plurality of bottom bond pads;
- an integrated circuit proximate a top surface of the substrate, the integrated circuit having terminals electrically coupled to a first subset of the plurality of top bond pads;
- a cap encapsulating the integrated circuit on at least a portion of the top surface of the substrate, the substrate having a second subset of the plurality of top bond pads positioned outside of a perimeter of the cap, and the cap comprising an encapsulant;
- and
- at least one extension feature comprising the encapsulant positioned on at least a portion of the top surface of the substrate, the at least one extension feature extending from the cap to a perimeter of the substrate, and the substrate having at least two bond pads of the second subset not covered by the at least one extension feature.
2 more elements
Dependencies are inferred from the claim text.