Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• providing a substrate;
• mounting a first internal integrated circuit structure and a second internal integrated circuit structure over the substrate;
• connecting the first internal integrated circuit structure and the second internal integrated circuit structure to the substrate with internal interconnects;
• mounting a first internal integrated circuit die between the first internal integrated circuit structure and the second internal integrated circuit structure and mounted over the substrate;
• forming asymmetric encapsulation structures above the first internal integrated circuit structure and the second internal integrated circuit structure;
• and
• encapsulating the first internal integrated circuit structure, the first internal integrated circuit die, and the internal interconnects with an encapsulation.

An integrated circuit packaging system comprising:

• a substrate;
• a first internal integrated circuit structure and a second internal integrated circuit structure mounted over the substrate;
• internal interconnects connecting the first internal integrated circuit structure and the second internal integrated circuit structure to the substrate;
• asymmetric encapsulation structures formed above the first internal integrated circuit structure and the second internal integrated circuit structure;
• and
• an encapsulation encapsulating the first internal integrated circuit structure and the internal interconnects.