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US 2010/0140565 A1Published application
EMI/RFI Shielding Resin Composite Material and Molded Product Made Using the Same
AssigneeCheil Industries Inc.
InventorsSung-Jun KIM, Chang-Min HONG
Life of this patent
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Abstract
Disclosed is an electromagnetic wave interference (EMI)/radio frequency interference (RFI) shielding resin composite material including (A) a thermoplastic polymer resin, (B) a tetrapod whisker, and (C) a low melting point metal.
Claims11
An electromagnetic wave interference (EMI)/radio frequency interference (RFI) shielding resin composite material, comprising:
- (A) a thermoplastic polymer resin;
- (B) a tetrapod whisker;
- and
- (C) a low-melting point metal.
1 more element
Dependencies are inferred from the claim text.